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Microporous Board

  • Price:

    Negotiable

  • minimum:

  • Total supply:

  • Delivery term:

    The date of payment from buyers deliver within days

  • seat:

    Shandong

  • Validity to:

    Long-term effective

  • Last update:

    2024-01-13 07:58

  • Browse the number:

    267

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Company Profile

Shandong Topower Pte Ltd

By certification [File Integrity]

Contact: sdzhuolipu(Mr.)  

Email:

Telephone:

Phone:

Area: Shandong

Address: Shandong

Website: http://www.tprefractory.com/ http://sdzhuolipu.gzeastups.com/

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Product details
Description

The main components of the microporous board is nano silicon dioxide and silicon carbide. It is a new type of heat insulation material obtained after a series of physical and chemical reactions, consisting of silicon dioxide particles with diameters of tens of nanometers, and infrared sunscreens and fibers. The thermal insulation performance of microporous board is lower than that of still air, which can greatly reduce the energy consumption of equipment and reduce the thickness of the required thermal insulation layer.

 

Features

 

1. Small specific heat, low heat storage, and thermal shock resistance. Temperature resistance up to 1100°C
2. An ideal high-temperature thermal insulation material.
3.Good thermal stability, less heat storage, thermal shock resistance, and long service life.
4. Non-toxic and environmentally friendly

 

Application

 

Microporous board  is suitable for applications with high requirements for thermal insulation and energy saving, or occasions where the thickness of the thermal insulation material is limited, such as Iron and steel metallurgical equipment, Ceramic furnaces, Glass furnaces and other industries.

 

Physical And Chemical Indicators

 

Brand

Property

TP950

TP1000

TP1100

Melting Point (℃)

≥1200

≥1200

≥1200

Operating Temperature (℃)

950

1000

1100

Density (kg/m³)

280-350

550-650

550-650

Compressive strength (MPa)

0.5

0.8-1.2

0.8-1.2

800℃

Heating wire shrink 800℃ (%)

≤1.9

≤1.9

≤1.9

 

 

Thermal Conductivity

（w/m.k）

 

200℃

0.016

/

/

 

400℃

0.021

0.043

0.047

 

600℃

0.026

0.057

0.058

 

800℃

0.035

0.063

0.069

 

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